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THIN FILM TESTING WITH THE
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| Rs | = F [ (Tu - Tl )/ Q ] - Rint (1) | |
| where | Rs | = thermal resistance of the sample |
| F | = heat flow transducer calibration factor | |
| Tu | = upper plate surface temperature | |
| Tl | = lower plate surface temperature | |
| Q | = heat flow transducer output | |
| Rint | = interface thermal resistance | |
In equation (1), both F and Rint are obtained during equipment calibration. Rint is the interface resistance between the sample and the adjacent surface plates. Rs includes the thermal contact resistance between individual layers if more than one sample is tested. For this method to produce thermal conductivity of the sample material accurately, the contact resistance must therefore be minimized by compressing the sample stack. Thin samples of rigid materials should not be tested by the stacking methods as the interface resistances may exceed the thermal resistance of the sample material itself.
If a stack of maximum five layers produces a thermal resistance greater than 0.001 mēK/W, thermal conductivity may be calculated from:
| k | = n * d / Rs | |
| where | n | = number of film layers |
| d | = individual film thickness | |
| Rs | = overall film thickness | |
If up to five layers tested together produces a thermal
resistance below 0.001 m²K/W, better results can be obtained by sandwiching
several different layers of sample material between two flat plates, e.g. 10mm
stainless steel, before they are tested in the QuickLine -10 or Model
2021. The presence of the stainless steel plates raises the measured thermal
resistance above the suggested lower limit, thereby ensuring a more accurate
measurement. To account for the resistance of the stainless steel plates, this
measurement must be carried out several times, each time with a different number
of layers between the plates. A graph of the measured thermal resistance as
a function of the number of sample layers tested shows that the data points
follow a straight line. Thermal conductivity of the sample material is the
reciprocal of the slope of this line. Usually, up to five different layers
of thin film material are tested by this method. The number of samples in each
layer, ranging from one to ten, depends on the thickness and thermal conductivity
of the material.
Software provided with the QuickLine -10 and Model
2021 includes the data analysis for thin film testing.
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Thin Film Data Analysis |
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Today's Date:
Saturday, 04-Jul-2009 20:00:52 MDT
Last modified 11/2007